Oven test part 2.
The question I have set about asking is, Is surface tension enough to keep components on the underside of a board whilst it is reheated to solder the top layer.
If your in a hurry: Yes it is.
If you have a few seconds longer, you may like to observe the evidence:
I baked some components onto a bit of gash stripboard (more about this later). It was a good job did this test as i discovered that the solder was all fully melted when the thermometer read about 160degC – really? i was expecting this to be at about the 200degC point. Ok is the thermometer lying? – it was cheap ebay fodder. Cue up the pan of boiling water. This came out at 99devidenceegC so within the tolerances I need. For now I will assume that the discrepancy at high temperature is due to the probe having a greater thermal mass and so lagging in temperature rise.
Step two was to mount the stripboard inverted so the components can fall off under gravity and repeat the heating step. With some solder paste on the top side to verify that a sufficient temperature has been reached, the parts behaved admirably. None have fallen. I pushed the heating step for longer than needed to make sure, this lead to my second discovery of the evening. When over heated, strip-board omits lots of smoke and fumes. Quite disarmingly, burnt stripboard smells of Naan bread! What does this mean, will i be able to eat naan in an Indian again?





